Non-Conductive Adhesive (NCA) Trapping Study in Chip on Glass Joints Fabricated Using Sn Bumps and NCA
نویسندگان
چکیده
Chip-on-glass (COG) bonding using a nonconductive adhesive (NCA) and the entrapment of NCA and fillers in the COG joints were studied. Sn was used as a bump material because it has a higher propensity of plastic deformation than an Au bump. Three types of Sn bumps were fabricated, electroplated Sn bumps, reflowed Sn bumps, and coined Sn bumps. Three types of NCAs were applied during COG bonding. The reflowed bump had the least amount of trapped NCA with fillers among the bumps studied. The NCA with the lowest viscosity was trapped the least compared to the other NCAs. The electrical test results showed that contact resistance increased with increasing amounts of trapped NCA with fillers in the COG joint. [doi:10.2320/matertrans.MRA2008071]
منابع مشابه
Characterizing Non-Conductive Adhesives using Finite Element Analysis: Residual Stress Determination
ABSTRACT This study aims to establish a methodology for determining the residual contact stress developed during fabrication of nonconductive adhesive (NCA) bonded flip-chip-on-flex (FCOF) microelectronics systems. The method is demonstrated for a selected non-conductive adhesive. Fabrication of an NCA bonded FCOF system requires a compressive force large enough to compensate for the inherent c...
متن کاملTheoretical study of Drug Delivery on Sn (CH3)2(N-acetyl-L-cysteinate) with SWCNT
The interaction of anticancer drug Sn (CH3)2(N-acetyl-L-cysteinate) with carbon nanotube (CNT)is investigated by Quantum chemical ab initio calculations at FIF/ (LanL2DZ+STO-3G) and HF/(LanL2DZ+6-31G) levels in gas phase and solution. The solvent effect is taken into account viathe self-consistent reaction field (SCRF) method. Carbon nanotubes can act as a suitable drugdelivery vehicle for inte...
متن کاملContact Resistance of Anisotropic Conductive Adhesive Film Based Flip-chip on Glass Packages
In a flip-chip-on-glass (FCOG) assembly, anisotropic conductive film (ACF) is used as the adhesive to bind the desired interconnection between the flip chip and glass substrate. However, it remains a challenge to develop the ACF bonded flip chip packages with low contact resistance. Considerable research has been conducted recently to investigate the effect of different parameters on the contac...
متن کاملSuper Thin Flip Chip Assemblies on Flex Substrates - Adhesive Bonding and Soldering Technology – Reliability Investigations and Applications
Thinned silicon chips with very thin bumps (5-7μm) mounted on flexible substrates open up new dimensions in packaging technologies. The use of flexible substrates enables a large variety of geometric possibilities including folding and bending. Conventional flip chip technology using pick&place and standard reflow processes is not suitable for the assembly of ultra thin components. This is base...
متن کاملElectrical reliability of electrically conductive adhesive joints: dependence on curing condition and current density
The use of electrically conductive adhesives as interconnection materials in electronic assembly process is increasingly becoming a vital part of the electronics industry. Flip-chip joining technique using conductive adhesives has been identi®ed as a key technology for future electronics assembly and manufacturing. The purpose of the present work is to investigate optimum conditions to achieve ...
متن کامل